Selection on Surfactant in Polishing Slurry for Chemical Mechanical Polishing 304 Stainless Steel

Abstract:

Stainless steel will become one of the main substrate materials for flexible large-scale displays. As the substrate of the flexible displays, the biggest problem of stainless steel is that the surface roughness is too large. It is necessary to polish the surface of stainless steel with ultra-precision. Chemical mechanical polishing (CMP) technology will be one of the most practical processing technologies to make the surface of stainless steel ultra-smooth and damage-free. In this paper, the material removal rate (MRR) and surface roughness were studied based on the hydrogen peroxide oxidant and ferric chloride oxidant with different surfactants in chemical mechanical polishing (CMP) slurry by experiments. The results show that it can obtain the maximum of the MRR and the optimal surface quality when using 0.04 wt% sodium hexadecyl sulfate as the surfactant of the hydrogen peroxide-oxalic acid based polishing slurry and when using 0.2 wt% nonylphenol ethoxylate or 0.8 wt% OP-10 emulsifier as the surfactant of the of ferric chloride-oxalic acid based polishing slurry. The results of this study can provide a reference for further research on the chemical mechanical polishing of stainless steel.

• Periodical: Key Engineering Materials (Volume 866)
• Pages: 125-134
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.866.125
• Online since: October 2020
• Authors: Jian Xiu Su*, Yong Sheng Wang, Xiao Feng Zhang, Hai Xu Liu, Zhan Kui Wang
• Keywords: 304 Stainless Steel, Chemical Mechanical Polishing, Material Removal Rate, Polishing Slurry, Surface Roughness, Surfactant

References

[1] Hanada T, Negishi T, Shiroishi I, et al. Plastic substrate with gas barrier layer and transparent conductive oxide thin film for flexible displays[J].Thin Solid Films,2010,518(11) 3089-3092.

DOI: 10.1016/j.tsf.2009.09.166

[2] Ju S, Li J, Liu J, et al. Transparent active matrix organic light-emitting diode displays driven by nanowire transistor circuitry [J]. Nano.Lett., 2008,8 (4) 997-1004.

DOI: 10.1021/nl072538+

[3] Logothetidis S, Laskarakis A. Towards the optimization of materials and processes for flexible organic electronics devices [J]. The European Physical Journal Applied Physics, 2009,46(1) 12502(1-9).

DOI: 10.1051/epjap/2009041

[4] Sekitani T, Nakajima H, Maeda H, et al. Stretchable active-matrix organic light-emitting diode display using printable elastic conductors[J].Nature Materials,2009,8(6) 494-499.

DOI: 10.1038/nmat2459

[5] Bae S, Kim H, Lee Y, et al. Roll-to-roll production of 30-inch graphene films for transparent electrodes [J]. Nature Nanotechnology, 2010, 5(8) 574-578.

DOI: 10.1038/nnano.2010.132

[6] Someya T. Flexible electronics: Tiny lamps to illuminate the body [J]. Nature Materials, 2010, 9(11) 879-880.

DOI: 10.1038/nmat2886

[7] XU Zheng, SONG Dan-dan, ZHAO Su-ling, et al. The Developments and Challenges in OLED, Flexible and See-through Display Technologies, and Organic Luminescent Materials. Advanced Display, 2009,101(6) 5-10.

[8] Sugimoto Akira, Ochi Hideo, Fujimure Soh, et al. Flexible OLED displays using plastic substrates [J] IEEE J Sel Top Quantum Electron, 2004, 10(1) 107-114.

DOI: 10.1109/jstqe.2004.824112

[9] Bardsley J N. International OLED technology roadmap [J]. IEEE J Sel Top Quantum Electron, 2004, 10(1) 3-9.

[10] Xie zhiyuan,Hung Liangsun,Zhu Furong.A flexible top-emitting organic light-emitting diode on steel foil[J]. Chem Phys Lett ,2003,381(5/6) 691-696.

DOI: 10.1016/j.cplett.2003.09.147

[11] Liu Haiyan. Performance and Test of Glass Substrate for TFT-LCD. Glass, 2009,36 (1) 22-24.

[12] WANG Yue, MAN Rui-lin, LIANG Yong-huang, et al. Progress in Research on Surface Polishing Technologies for Stainless Steel. Electroplating & Pollution Control, 2012,32(2) 1-4.

[13] K.P. Han, J.L. Pang. Chemical Polishing for Stainless Steel. Journal of the Electrochemical Society of India. 1996, 45 (1) 50-52.

[14] H. Keping, F. Jingli. Study on chemical polishing for stainless steel. Transactions of the Institute of Metal Finishing, 1998.76 (1) 24-25.

DOI: 10.1080/00202967.1998.11871186

[15] YAO Ying-wu,QIU Li,ZHAO Chun-mei,et al. Chemical Polishing Technology of Stainless Steel. Plating & Finishing, 2010,32(9) 5-8.

[16] Xiaokai Hu,Zhitang Song,Fei Qin,et al. Chemical mechanical polishing of stainless steel foil as flexible substrate. Applied Surface Science, 2012 ,258(15) 5798-5802.

DOI: 10.1016/j.apsusc.2012.02.100

[17] ZHENG Hai-feng,WEI Xin,XIE Xiao-zhu, et al. Research on process temperature during chemical mechanical polishing of stainless steel substrate. Diamond & Abrasives Engineering, 2014,34(2) 20-24.

[18] Jianxiu Su, Jiapeng Chen, Haifeng Cheng. Analysis on the influence of oxidant in CMP of ultra-thin stainless steel [J]．Advanced Materials Research ,1027 (2014) 167-170.

DOI: 10.4028/www.scientific.net/amr.1027.167

[19] Jiapeng Chen, Jianguo Yao, Lijie Ma, et al. Study of the Slurry in CMP 304 Ultra-Thin Stainless Steel Surface[J]．Advanced Materials Research,1027 (2014) 235-239.

DOI: 10.4028/www.scientific.net/amr.1027.235

[20] CHEN Jiapeng, Chen Shaokun, Li Qing,et al. Study on chemical mechanical polishing of 304 stainless steel sheet based on alkaline polishing slurry. Diamond & Abrasives Engineering, 2016,36(2) 6-9.

[21] Lin Bin-Tiao,Chen C.S., Yeh W.K. Surfactant behavior and study in slurry. IEEE/SEMI advanced semiconductor manufacturing conference. 2002:362-367.

DOI: 10.1109/asmc.2002.1001634