A Study on the Thermal Conductivity of Thermal Grease According to Cu-Ni Content

Abstract:

An increase in power consumption density is related to the internal thermal characteristics of an electronic device, and the heat dissipation of the device is directly related to the high performance and miniaturization of the device. TIM (thermal interface material) with excellent internal heat dissipation performance are mainly used to improve the heat dissipation performance of electronic devices. Recently, the need for a high-efficiency TIM with high-performance thermal conductivity and low thermal contact resistance has increased. In this study, thermal grease was prepared by mixing Cu-Ni nanopowders with silicon oil, the thermal grease was then used as a heat transfer material. Compared to silicone thermal grease, the thermal conductivity of all prepared samples was excellent. In particularly, thermal conductivity was improved by about maximum 212% compared to that of thermal silicone of thermal grease mixed with Cu-Ni powder.

• Periodical: Key Engineering Materials (Volume 880)
• Pages: 71-76
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.880.71
• Online since: March 2021
• Authors: Haneul Kang, Hyunji Kim, Sunghoon Im, Jinho Yang, Sunchul Huh
• Keywords: Cu-Ni Nanopowder, Thermal Conductivity, Thermal Grease, Thermal Interface Materials

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