Thermal and Vibration Mechanical Reliability of Multicoat Compound Thin-Film Thermocouple

Abstract:

For the thin-film thermocouple with ITO/In₂O₃ as the functional layer, the mechanical reliability of their composite multilayer membrane structures under high temperature and random vibration conditions are discussed. Using the elastic plasticity model based on the finite element simulation method, the stress and strain distribution patterns caused by the thermal mismatch and vibration of multilayer film materials are systematically analyzed, and the distribution of the stress concentration and strain accumulation regions that may lead to fatal reliability problems are characterized. When a thermal load of 1000 °C is applied, the protective layer of the structure is vulnerable to severe stress environment. In addition, plastic deformation occurs in the adjacent layers of the functional layer, making it a weak reliability area. The stress generated by the vibration load is much smaller than the thermal stress, which mainly occurs at the roots of the structure, where prolonged loading may lead to fatigue failure.

• Periodical: Key Engineering Materials (Volume 881)
• Pages: 57-63
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.881.57
• Online since: April 2021
• Authors: Yi Yun Xi*, Yu Feng Sun, Ting Chun Hu, Guang Yan Zhao
• Keywords: Mechanical Reliability, Thermal Load, Thin Film Stress, Thin Film Thermocouple, Vibration Load

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