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HomeKey Engineering MaterialsKey Engineering Materials Vols. 89-91Dielectric Properties and Thermal Conductivity of...

Dielectric Properties and Thermal Conductivity of SiAlON with Titanium Additives

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Silicon Nitride '93

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Periodical:

Key Engineering Materials (Volumes 89-91)

Pages:

455-460

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.89-91.455

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Online since:

August 1993

Authors:

V. Petrovski

Keywords:

Dielectric Property, Grain Boundary Phase, ß-SiAlON, Thermal Conductivity (TC), Titanium Compound

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© 1994 Trans Tech Publications Ltd. All Rights Reserved

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