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HomeKey Engineering MaterialsKey Engineering Materials Vols. 89-91Improvements in the Creep Strength of HPSN by...

Improvements in the Creep Strength of HPSN by Optimization of Additive Content and Thermal Treatment

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Silicon Nitride '93

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Periodical:

Key Engineering Materials (Volumes 89-91)

Pages:

593-598

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.89-91.593

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Online since:

August 1993

Authors:

A. Rendtel, H. Hübner, C. Schubert

Keywords:

Creep Behaviour, Crystallization, High-Temperature Mechanical Property, Intergranular Phase

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© 1994 Trans Tech Publications Ltd. All Rights Reserved

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