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HomeKey Engineering MaterialsKey Engineering Materials Vols. 89-91

Key Engineering Materials Vols. 89-91

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.89-91

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Table of Contents

Paper Title Page

Improvements in the Creep Strength of HPSN by Optimization of Additive Content and Thermal Treatment

Authors: A. Rendtel, H. Hübner, C. Schubert

593

Structure Dependent Creep and Crack Propagation in Silicon Nitrides

Authors: E. Gehrke, Hermann Riedel, H. Schubert, G. Schneider

599

Thermal Shock and Thermal Cycling Behavior of Silicon Nitride Ceramics

Authors: G. Kirchhoff, M. Holzherr, U. Bast, U. Rettig

605

Characterization of Two Si₃N₄ Commercially Available Ceramics

Authors: M. Bougoin

611

Thermal Shock Properties of SiC Whisker-Reinforced Silicon Nitride Ceramics

Authors: Y. Sato, M. Ueki

613

Tensile Creep Behaviour ot Two Silicon Nitride Materials

Authors: Stephen Osgerby, M.S. Peck, B.F. Dyson

617

Tensile Creep of a Silicon Nitride Ceramic

Authors: R. Krause, Sheldon M. Wiederhorn

619

Mechanical Properties of Sintered and Gas Pressure Sintered Silicon Nitride

Authors: K. Rundgren, N. Modig, T. Nose, H. Kubo

625

Creep Rutpure of Si₃N₄ Ceramics for Gas Turbine

Authors: Masataka Mizuno, Hatsuhiko Usami

627

High-Temperature Creep Deformation of Hot-Pressed Silicon Nitride

Authors: A.A. Postnikov, V.G. Verjovka

633