Investigation the Ultrasonic Vibration on Tin Soldering Welding of Copper Wires and Plates

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Abstract:

Ultrasonic-assisted soldering welding is widely applied for joining difficult materials. The cavitation phenomenon in liquid always occurs during the ultrasonic excitation. Base metals are striked by ultrasonic cavitation, creating erosion on the surface. The soft solder materials are penetrated on the rough surface, generated inter-metallic compounds. This work expresses the design of ultrasonic soldering machine using 20 kHz source and steel sonotrode. The curvature of reflecting plates with specific radius and their location are also condidered. The major technological parameters of ultrasonic soldering welding such as ultrasonic exciting time, power and curvature radii of reflecting plate are discussed. Tin soldering material is utilized for joining copper wires and plates are investigated. SEM images on the surface of tin soldering on cooper plates and tensile strength are investigated.

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392-397

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November 2021

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© 2021 Trans Tech Publications Ltd. All Rights Reserved

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[1] T-H. Nguyen, Le Q. T., Nguyen H. L., M. H. Ngo and V. A. Nguyen, Effects of Different Roller Profiles on the Microstructure and Peel Strength of the Ultrasonic Welding Joints of Nonwoven Fabrics, Appl. Sci. 2020, 10, 4101.

DOI: 10.3390/app10124101

Google Scholar

[2] T. H. Nguyen, Q. T. Le, C. L. Tran and H. L. Nguyen, Investigation the Amplitude Uniformity on the Surface of the Wide-Blade Ultrasonic Plastic Welding Horn, IOP Conf. Series: Materials Science and Engineering 241 (2017) 012023.

DOI: 10.1088/1757-899x/241/1/012023

Google Scholar

[3] Kago Keitaro, Suetsugu Kenichiro, Hibino Shunji, Ikari Takashi, Furusawa Akio, Takano Hiroaki, Horiuchi Toshihisa, Ishida Kenji, Sakaguchi Takuma, Kikuchi Shiomi, Matsushige Kazumi, Novel Ultrasonic Soldering Technique for Lead-Free Solders, Materials transactions, 45.

DOI: 10.2320/matertrans.45.703

Google Scholar

[4] Jung H. Kim, Jihye Lee, and Choong D. Yoo, Soldering method using longitudinal ultrasonic,, IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 3, pp.493-493.

DOI: 10.1109/tcapt.2005.848576

Google Scholar

[5] Toru Nagaoka, Yoshiaki Morisada, Masao Fukusumi, Tadashi Takemoto, Joint strength of aluminum ultrasonic soldered under liquidus temperature of Sn–Zn hypereutectic solder,, Journal of Materials Processing Technology, Vol. 209, No. 11, pp.5054-5059.

DOI: 10.1016/j.jmatprotec.2009.02.003

Google Scholar

[6] Ding Min, Zhang Pei-lei, Zhang Zhen-yu, Yao Shun, Direct-soldering 6061 aluminum alloys with ultrasonic coating,, Ultrasonics Sonochemistry, Vol. 17, No. 1, pp.292-297.

DOI: 10.1016/j.ultsonch.2009.10.007

Google Scholar

[7] Toru Nagaoka, Yoshiaki Morisada, Masao Fukusumi, Tadashi Takemoto, Selection of soldering temperature for ultrasonic-assisted soldering of 5056 aluminum alloy using Zn–Al system solders,, Vol. 211, No. 21, pp.1534-1539.

DOI: 10.1016/j.jmatprotec.2011.04.004

Google Scholar

[8] Zhiwu Xu, Lin Ma, Jiuchun Yan, Shiqin Yang, Shanyi Du, Wetting and oxidation during ultrasonic soldering of an alumina reinforced aluminum–copper–magnesium (2024 Al) matrix composite,, Composites Part A: Applied Science and Manufacturing, Vol. 43, No. 3, pp.407-414.

DOI: 10.1016/j.compositesa.2011.12.006

Google Scholar