Morphological and Structural Properties of Sn-Bi Lead-Free Solder in 6 M Potassium Hydroxide

Abstract:

Sn-based lead-free solder alloys have been explored extensively as an alternative to the conventional Sn–Pb solder alloys. While the miniaturization of electronic devices and the growth of appliance area, the corrosion resistance of solder alloys play a crucial element in the reliability of electronic devices in a prolonged period of service. This paper determines the corrosion effect of Sn-Bi solder lead-free solder, particularly immersed in alkaline solution which is potassium hydroxide. Morphological and elemental analyses reveal the formation of oxides on the surface after immersion after using a scanning electron microscope, dispersive energy X-ray and X-ray diffraction. The result of morphology reveals that the Sn matrix in plateau indicated dark contrast while Bi-rich in the lamellar eutectic structure indicated in light contrast appearance. In addition, phase and elemental analyses revealed the formation of mixed corrosion products of SnO, SnO₂ and Bi₂O₃ on the surface after testing. It is hoped that this finding will provide some helpful evidence in clarifying the corrosion progress of lead-free solder alloys. Furthermore, the remaining corrosion potential and current of Sn-Bi in 6 M potassium hydroxide solutions in this research are proposed.

• Periodical: Key Engineering Materials (Volume 908)
• Pages: 462-466
• DOI: https://doi.org/10.4028/p-5a7sj7
• Online since: January 2022
• Authors: Mohamad Najmi Masri*, Mohamad Firdaus Sazali, Muhammad Firdaus Mohd Nazeri, Ahmad Azmin Mohamad, Teo Pao Ter
• Keywords: Dispersive Energy X-Ray, Potassium Hydroxide, Scanning Electron Microscope, Sn-Lead, X-Ray Diffraction (XRD)

References

[1] W. Y. Wong, R. A. Shamsudin, M. F. Mohd Nazeri, and M. N. Masri, The Preliminary Study of the Addition Zinc in Tin-Copper Lead Free Solder, Mater. Sci. Forum. 1010 (2020) 104-108.

DOI: 10.4028/www.scientific.net/msf.1010.104

[2] M. N. Masri, M. K. Samsudin, M. A. Sulaiman, M. Mohamed, M. F. M. Amin, M. H. M. Amini, M. K. A. A. Razak, N. H. Abdullah, M. B. A. Bakar, M. I. Ahmad, Microscopic Study on the Corrosion of Underground Pipeline, Key Eng. Mater. 694 (2016) 172-176.

DOI: 10.4028/www.scientific.net/kem.694.172

[3] H. Kang, S. H. Rajendran, and J. P. Jung, Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics, Metals.11, 2 (2021) 364.

DOI: 10.3390/met11020364

[4] Y.Z. Peng C.J. Li, J.J. Yang, J.T. Zhang, J.B. Peng, G.J. Zhou, C.J. Pu, J.H. Yi, Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders, Metals. 11, 4 (2021) 538.

DOI: 10.3390/met11040538

[5] M. F. M. Nazeri, M. N. Masri, and A. A. Mohamad, Post-Corrosion Mechanical Analysis of Sn-Zn Alloys: A Short Review, IOP Conf. Ser.: Mater. Sci. Eng.701, 1 (2019) 012049.

DOI: 10.1088/1757-899x/701/1/012049

[6] M. Muhamad, M. Masri, M. Nazeri, and A. Mohamad, The Effect of Bismuth Addition on Sn-Ag-Cu Lead-Free Solder Properties: A Short Review, IOP Conf. Ser.: Earth Environ. Sci. 596, 1 (2020) 012007.

DOI: 10.1088/1755-1315/596/1/012007

[7] F. S. M. Tarmizi, M. N. Masri, M. F. M. Nazeri, and A. A. Mohamad, Effect Additions Zn on Sn-0.7 Cu Lead-Free Solder: A Short Brief, IOP Conf. Ser.: Earth Environ. Sci. 596, 1 (2020) 012038.

DOI: 10.1088/1755-1315/596/1/012038

[8] Z.-L. Wang, M. Wang, L.X. Li, and Y.P. Bao, Permeation behavior of low-melting-point Sn–Bi alloy in the fiber channel of pine wood, Materials & Design. 196 (2020) 109068.

DOI: 10.1016/j.matdes.2020.109068

[9] Y. Hirata, C. H. Yang, S. K. Lin, and H. Nishikawa, Improvements in mechanical properties of Sn-Bi alloys with addition of Zn and In, Mater. Sci. Eng.: A. (2021) 141131.

DOI: 10.1016/j.msea.2021.141131

[10] C. Luo, X. Qiu, Y. Ruan, Y. Lu, and F. Xing, Effect of Bi addition on the corrosion resistance and mechanical properties of sintered NdFeB permanent magnet/steel soldered joints, Mater. Sci. Eng.: A, 792 (2020) 139832.

DOI: 10.1016/j.msea.2020.139832

[11] P. Ranjan, D. H. Nguyen, K. Tanaka, H. Suematsu, R. Jayaganthan, and R. Sarathi, Synthesis, characterisation and formation mechanism of Sn-0.75 Cu solder nanoparticles by pulsed wire discharge, Appl. Nanosci. 9, 3 (2019) 341-352.

DOI: 10.1007/s13204-018-0910-x

[12] M. Yusoff, M, Mohamed, M. B. A. Bakar, M. N. Masri, N. Z. Noriman, M. U. S. U. Omar, Copper alloy reinforced by graphene by powder metallurgy technique, AIP Conf. Proc. 2213, 1 (2020) 020264.

DOI: 10.1063/5.0000413

[13] S. Li, X. Wang, Z. Liu, Y. Jiu, S. Zhang, J. Geng, X. Chen, S. Wu, P. Hu, W. Long, Corrosion behavior of Sn-based lead-free solder alloys: a review, J. Mater. Sci. Mater. 31 (2020) 9076-9090.

DOI: 10.1007/s10854-020-03540-2

[14] S. Cai, X. Luo, J. Peng, Z. Yu, H. Zhou, N. Liu, X. Wang, Deformation mechanism of various Sn-x Bi alloys under tensile tests, Advanced Composites and Hybrid Materials. (2021) 1-13.

DOI: 10.1007/s42114-021-00231-2

[15] M. Li, Y. Tang, Z. Li, M. Zhu, and W. Wang, Microstructure and mechanical properties of Sn–58Bi eutectic alloy with Cu/P addition, Mater. Res. Express. 7, 11 (2020) 116502.

DOI: 10.1088/2053-1591/abc4f8

[16] M. Mohamad, R. Wannahari, R. Mohammad, N.F. Shoparwe, A.S.M. Nawi, W.L. Kwan, J.W. Lim, Adsorption of malachite   green   dye using spent coffee ground biochar: optimisation using response surface methodology, J. Teknol. 83:1 (2021) 27-36.

DOI: 10.11113/jurnalteknologi.v83.14904

[17] R. Taufik, M. Mohamad, R. Wannahari, N.F. Shoparwe, W.H.W. Osman, P.T. Teo and M.N. Masri, Spent coffee ground as low-cost adsorbent for congo red dye removal from aqueous solution, IOP Conf. Ser.: Earth Environ. Sci. 765 (2021) 012089.

DOI: 10.1088/1755-1315/765/1/012089