Fabrication of Three-Dimensional Microstructure Film by Ni-Cu Alloy Electrodeposition for Joining Dissimilar Materials

Abstract:

Metals with a three-dimensional microstructure film can be joined to plastics by the anchor effect. The three-dimensional microstructure films can be electrodeposited by a Ni-Cu alloy. In this study, the effects of the ratio of the concentration of Ni amidosulfate and Cu sulfate in the plating solution and plating current density on the shapes and microstructures of electrodeposited films were investigated. When the ratio of the concentration of the Ni amidosulfate and the Cu sulfate is 0.47-1.4:0.06 (M/L), a dendritic-type electrodeposited structure was generated at plating current density of 10 mA/cm². When the ratio of the concentration of the Ni amidosulfate and the Cu sulfate is 0.47:0.6-1.2 (M/L), a feathery-type and needle-type electrodeposited structure was generated.

• Periodical: Materials Science Forum (Volume 1016)
• Pages: 738-743
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.1016.738
• Online since: January 2021
• Authors: Tatsuya Kobayashi, Ikuo Shohji
• Keywords: Dissimilar Materials Joining, Electrodeposition, Ni-Cu Alloy, Three-Dimensional Microstructure Film

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