Surface Properties of Copper-Aluminum Alloys

Abstract:

The polytherms of density, surface tension of the Cu-Al system melts and wetting angles of Ni-Cr, Co-Cr substrates, 25X18H9C2 stainless steel and titanium were studied by the sessile drop method. The drop contour was processed by dint of current information technologies, in particular, using the ImageJ software package [1]. The equations of density polytherms and surface tension of the Cu-Al system melts were established. It was shown that Cu-Al melts wet the substrates at 1000 K and more. We revealed the features of temperature dependences of the wetting angles.

• Periodical: Materials Science Forum (Volume 1022)
• Pages: 224-228
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.1022.224
• Online since: February 2021
• Authors: R.A. Kutuev*, Victor A. Sozaev, A.Kh. Shermetov
• Keywords: Density Polytherms, Surface Tension, Wetting Angles

References

[1] Stalder A.F., Kulik G., Sage D., Barbieri L., Hoffmann P. A., Snake-based approach to accurate determination of both contact points and contact angles Colloids and Surfaces A: Physicochem. Eng. Aspects, 286, (2006), 92.

DOI: 10.1016/j.colsurfa.2006.03.008

[2] Orkvasov T.A., Ponezhev M.Kh., Sozaev V.A., Shidov Kh.T., Temperature dependence study of the surface tension of aluminum alloys High Temperature, 34(3), (1996), 493-495.

[3] Naidich Iu.V., Eremenko V.N., Kirichenko L.F., Surface tension and density of liquid copper-aluminum alloys Journal of Inorganic Chemistry, 7(2), (1962), 333.

[4] Ponezhev M.Kh., Surface properties of some liquid metal systems based on copper, aluminum, Abstract of the cand. of phys.-math. sciences. Nalchik, KBSU, (2001).

[5] Kurochkin A.R., Popel P.S., Iagodin D.A., Borisenko A.V., Okhapkin A.V., Density of copper-aluminum alloys at temperatures up to 1400 °C according to measurement results by the gamma method, High Temperature, 51(2), (2013), 224-232.

DOI: 10.1134/s0018151x13020120

[6] Schmitz J., Brillo J., Egry I., Surface tension of liquid Al-Cu and wetting at the Cu/Sapphire solid-liquid interface, The European Physical Journal Special Topics, 2014. Vol. 223 (3), (2014), 469–479.

DOI: 10.1140/epjst/e2014-02103-5

[7] Nizhenko V.K., Floka L.I., Surface tension of metals and alloys. Handbook. Moscow, Metallurgy, (1981).

[8] Plevachuk Y., Sklyarchuk V., Yakymovych A., Eckert S., Willers B., Eigenfeld K., Density, viscosity and electrical conductivity of hypoeutectic Al-Cu liquid alloys Metallurgical and materials transactions, 39a, (2008), 3040−3045.

DOI: 10.1007/s11661-008-9659-2

[9] Kurochkin A.R., Popel P.S., Iagodin D.A., Borisenko A.V., Bulk properties of copper-aluminum melts at temperatures up to 1400 °C, Thermophysics and Aeromechanics, 20 (4), (2013), 417-426.

DOI: 10.1134/s0869864313040033

[10] Brillo J., Egry I., Westphal J., Density and thermal expansion of liquid binary Al-Ag and Al-Cu alloys, Int. J. Mat. Res., 99, (2008), 162−167.

DOI: 10.3139/146.101623

[11] Brodova I.G., Popel P.S., Barbin N.M., Vatolin N.A., Melts as the basis for the formation of the structure and properties of aluminum alloys. Ekaterinburg, UD RAS, (2005).