Effect of Additives on Thermal Conductivity of Si₃N₄ Ceramics

Abstract:

Compared with traditional ceramics, Si₃N₄ ceramics have the characteristics of high theoretical thermal conductivity, high thermal shock resistance, high oxidation resistance, high strength, and strong current carrying capacity. It is a potential high-speed circuit and high-power device for heat dissipation and heat dissipation. Sealing material. For applications in 5these fields, β-Si₃N₄ with a relatively stable structure and high thermal conductivity is an ideal material. However, β-Si₃N₄ powder is difficult to sinter as a raw material. Therefore, the prepared Si₃N₄ generally has a low density, and there are various defects in the crystal. The existence of these defects will cause interference and scattering of heat in the transfer process. Limits the application of β-Si₃N₄ ceramics. Studies have shown that the introduction of different additives can form a liquid phase at high temperatures, which can effectively reduce the firing temperature of the sample and increase the density. At the same time, it can also remove lattice oxygen, weaken the intercrystalline phase, and promote the α→β phase transition. Thereby improving the thermal conductivity and sintering performance of Si3N4 ceramics. Therefore, this article reviews the types of additives and their effects on the properties of Si₃N₄ ceramics and their mechanism. Trying to find an additive system for the preparation of high thermal conductivity Si₃N₄ ceramics with excellent comprehensive performance, hoping to provide help for the work and researchers engaged in the research on the thermal conductivity of Si₃N₄ ceramics.

• Periodical: Materials Science Forum (Volume 1036)
• Pages: 185-195
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.1036.185
• Online since: June 2021
• Authors: Zi Hao Chen, Qiang Gu, Wei Kui Ma, Guo Qi Liu*
• Keywords: Additives, Silicon Nitride Ceramics, Thermal Conductivity

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