Curing Kinetics of Epoxy Adhesive by Non-Isothermal DSC

Abstract:

Non-isothermal DSC has been used to investigate the curing kinetics of epoxy adhesives (DGEBA-cycloaliphatic amine). The epoxy samples were scanned on DSC with five heating rates (5°C/min, 7.5°C/min, 10°C/min, 12.5°C/min, and 15°C/min). The curing kinetics were obtained through ASTM standards E2890 and E698 (the Ozawa and Kissinger methods). The kinetic parameters obtained include Ea (activation energy), A (pre-exponential factor), and n (reaction order). The activation energy calculated from the Kissinger and Ozawa method was slightly different but insignificant. The reaction rate (dα/dt) and degree of curing/conversion (α) relationship towards temperature (T), and time (t) was also investigated. The curing process's reaction rate (dα/dt) has maximum value; it can no longer increase after a specific conversion rate (α).

• Periodical: Materials Science Forum (Volume 1114)
• Pages: 145-152
• DOI: https://doi.org/10.4028/p-E5VlmG
• Online since: February 2024
• Authors: Wiwiek Utami Dewi, Rizky Sutrisna, Heru Supriyatno, Sotya Astutiningsih, Mochamad Chalid*
• Keywords: Adhesive, Curing Kinetics, DSC, Epoxy, Kissinger, Non-Isothermal, Ozawa

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