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HomeMaterials Science ForumMaterials Science Forum Vols. 113-115High Temperature Deformation and Dynamic...

High Temperature Deformation and Dynamic Recrystallization of some Two-Phase Copper Alloys

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Recrystallization '92

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Periodical:

Materials Science Forum (Volumes 113-115)

Pages:

213-218

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.113-115.213

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Online since:

January 1993

Authors:

M.G. Ardakani, John F. Humphreys

Keywords:

Copper (Cu), Dispersion Strengthening, Dynamic Recrystallization (DRX), Grain Boundary Sliding (GBS), High Temperature Deformation, Internal Oxidation, Two-Phase, Void

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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