The book emphasizes the importance of recrystallization and related processes in the development of advanced materials, such as metal-matrix composites, intermetallic and ceramic materials, and thin films. The volume focusses on the control of the microstructure during thermomechanical processing.

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eBook:

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ToC:

Table of contents

Editors:

M. Fuentes and J. Gil Sevillano

DOI:

https://doi.org/10.4028/b-3NJxjq

THEMA:

TGM

BISAC:

TEC021000

Keywords:

Aluminum (Al), Annealing, Copper (Cu), Dynamic Recovery, Dynamic Recrystallization (DRX), Grain Boundary, Grain Growth, Grain Size, Hot Deformation, Microalloyed Steel, Microstructure, Nucleation, Precipitation, Recovery, Recrystallization, Recrystallization Kinetics, Secondary Recrystallization, Static Recrystallization, Texture, Thin Film

Details:

Proceedings of the International Conference on Recrystallization, San Sebastian, Spain, September 1992

Pages:

752

Year:

1993

ISBN-13:

9780878496495

ISBN-13 (CD):

9783038597858

ISBN-13 (eBook):

9783035704709

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