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Diffusion Foundations and Materials Applications
Journal of Metastable and Nanocrystalline Materials
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Books by Keyword: Copper (Cu)
Books
Edited by:
T. Chandra, N. Wanderka, W. Reimers , M. Ionescu
Online since: January 2010
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This proceedings supplement contains further selected papers from the 6th International Conference on Processing and Manufacturing of Advanced Materials – THERMEC’2009, held during the period, August 25-29, 2006, in Berlin , Germany under the co-sponsorship of The Minerals, Metals & Materials Society ( TMS) ,USA.
This proceedings supplement contains further selected papers from the 6th International Conference on Processing and Manufacturing of Advanced Materials – THERMEC’2009, held during the period, August 25-29, 2006, in Berlin , Germany under the co-sponsorship of The Minerals, Metals & Materials Society ( TMS) ,USA.
Edited by:
Amir Eliezer
Online since: January 2010
Description: The aim of this edition is to increase the worldwide awareness of corrosion-related issues and to develop national and international industrial-scientific cooperation in order to find practical solutions to the US$1.8 trillion/pa corrosion-cost worldwide.
Edited by:
Prof. Andreas Öchsner, Prof. Graeme E. Murch and Prof. Ali Shokuhfar
Online since: March 2009
Description: The goal of this special volume was to provide a unique opportunity to exchange information, present the latest results and to review relevant issues in contemporary diffusion research.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Edited by:
Prof. Graeme E. Murch
Online since: January 2009
Description: This periodical edition includes peer-reviewed scientific and engineering papers on all aspects of research in the area of nanoscience and nanotechnologies and wide practical application of the achieved results.
Edited by:
Paul Mertens, Marc Meuris and Marc Heyns
Online since: January 2009
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The contents of this publication include every conceivable issue related to contamination, cleaning and surface preparation during mainstream large-scale integrated circuit manufacture. Typically, silicon is used as the main semiconductor substrate. However, other semiconducting materials such as SiGe and SiC are currently being used in the source-sink junction areas, and materials such as Ge and III-V compounds are being considered for the transistor channel region of future-generation devices.
The contents of this publication include every conceivable issue related to contamination, cleaning and surface preparation during mainstream large-scale integrated circuit manufacture. Typically, silicon is used as the main semiconductor substrate. However, other semiconducting materials such as SiGe and SiC are currently being used in the source-sink junction areas, and materials such as Ge and III-V compounds are being considered for the transistor channel region of future-generation devices.
Edited by:
Ch. Linsmeier and M. Reinelt
Online since: December 2008
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The development of materials designed for application in extreme environments is a very active field of research. In recent years, it has been realized by the materials science community that solutions to demanding applications in different fields can be identified by implementing common materials concepts. Research effort and technological development, driven by application requirements, are now a bridge between apparently separate communities. As first realized by the European Integrated Project “ExtreMat – New Materials for Extreme Applications”, common materials solutions are now being sought and found in the fields of thermal management materials, protective materials, radiation-resistant materials, bonding and interfaces, as well as advanced materials characterization and application-oriented testing.
The development of materials designed for application in extreme environments is a very active field of research. In recent years, it has been realized by the materials science community that solutions to demanding applications in different fields can be identified by implementing common materials concepts. Research effort and technological development, driven by application requirements, are now a bridge between apparently separate communities. As first realized by the European Integrated Project “ExtreMat – New Materials for Extreme Applications”, common materials solutions are now being sought and found in the fields of thermal management materials, protective materials, radiation-resistant materials, bonding and interfaces, as well as advanced materials characterization and application-oriented testing.
Edited by:
Yung-Jen Lin and Wen-Cheng J. Wei
Online since: June 2008
Description: Engineering materials have long been challenges to, as well as the foundations of, industries and technologies. New technologies and new devices become available largely through the introduction of new materials or the improvement of existing materials.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Edited by:
Pavel Šandera
Online since: December 2007
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The main goal of these proceedings was to demonstrate the use of a variety of multi-scale approaches, ranging from the atomistic to the macroscopic level, and in this it succeeds admirably.
The main goal of these proceedings was to demonstrate the use of a variety of multi-scale approaches, ranging from the atomistic to the macroscopic level, and in this it succeeds admirably.
Edited by:
Dr. Paul W. Mertens, Marc Meuris and Marc Heyns
Online since: November 2007
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This collection of 86 peer-reviewed papers covers all aspects of the use of ultra-clean technology for large-scale integration on semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.
This collection of 86 peer-reviewed papers covers all aspects of the use of ultra-clean technology for large-scale integration on semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.
Edited by:
S.-J.L. Kang, M.Y. Huh, N.M. Hwang, H. Homma, K. Ushioda and Y. Ikuhara
Online since: October 2007
Description: Recrystallization and grain-growth, together with phase transformations, are the fundamental processes of microstructural evolution which occur during the thermomechanical treatment of engineering materials.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Volume is indexed by Thomson Reuters CPCI-S (WoS).