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THERMEC 2009 Supplement
Description:
Volume is indexed by Thomson Reuters CPCI-S (WoS).
This proceedings supplement contains further selected papers from the 6th International Conference on Processing and Manufacturing of Advanced Materials – THERMEC’2009, held during the period, August 25-29, 2006, in Berlin , Germany under the co-sponsorship of The Minerals, Metals & Materials Society ( TMS) ,USA.
This proceedings supplement contains further selected papers from the 6th International Conference on Processing and Manufacturing of Advanced Materials – THERMEC’2009, held during the period, August 25-29, 2006, in Berlin , Germany under the co-sponsorship of The Minerals, Metals & Materials Society ( TMS) ,USA.
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Info:
eBook:
ToC:
Editors:
T. Chandra, N. Wanderka, W. Reimers , M. Ionescu
THEMA:
TGM
BISAC:
TEC021000
Keywords:
Aging, Biomaterial, Copper (Cu), Electron Backscatter Diffraction (EBSD), Heat Treatment, Hot Deformation, Linear Friction Welding, Mechanical Property, Microstructure, Nanocomposite, Nucleation, Precipitation, Recrystallization, Residual Stress, Severe Plastic Deformation (SPD), Stainless Steel (SS), Texture, Ti6Al4V, Titanium (Ti), X-Ray Diffraction (XRD)
Details:
Supplement to THERMEC 2009, 6th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, Berlin, Germany, August 25-29, 2009
Pages:
780
Year:
2010
ISBN-13 (softcover):
9780878492930
ISBN-13 (CD):
9783035719949
ISBN-13 (eBook):
9783038134152
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