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Engineering Materials III
Description:
Engineering materials have long been challenges to, as well as the foundations of, industries and technologies. New technologies and new devices become available largely through the introduction of new materials or the improvement of existing materials.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
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978-3-03813-215-8
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978-0-87849-374-6
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Info:
eBook:
ToC:
Editors:
Yung-Jen Lin and Wen-Cheng J. Wei
THEMA:
TGM
BISAC:
TEC021000
Keywords:
Casing, Chemical Bath Deposition (CBD), Copper (Cu), Current Stability, Diffusion, Fatigue Life, High-Temperature, Interface, Mechanical Property, Microalloyed, Micro-SOFC, Microstructure, Non-Quenched Steel, Petroleum, Rapid Thermal Annealing (RTA), Seal, Secondary Dendrite Arm Spacing, Silver, Transit Vehicle, Vacuum Repair Brazing
Details:
Selected, peer reviewed papers from the 3rd Cross-Taiwan-Strait Conference on Engineering Materials, Hsinchu, Taiwan, November 16-17, 2007
Pages:
164
Year:
2008
ISBN-13 (softcover):
9780878493746
ISBN-13 (CD):
9783908453284
ISBN-13 (eBook):
9783038132158
Permissions CCC:
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Review from Ringgold Inc., ProtoView:
This collection of 20 peer-reviewed research papers is aimed at material science engineers who need to be informed of the latest advances in iron and steel, non- ferrous alloys, ceramics and composites. Lin (materials engineering, Tatung U., Taiwan) and Wei (materials science and engineering, National Taiwan U.) have edited the proceedings of a third conference on advanced materials research for scientists from "both sides of the Taiwan Strait." This relatively informal series of conferences are designed to exchange innovations among peers in a competitive yet dynamic engineering market.