Volume is indexed by Thomson Reuters CPCI-S (WoS).
This collection of 86 peer-reviewed papers covers all aspects of the use of ultra-clean technology for large-scale integration on semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.

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eBook:

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ToC:

Table of contents

Editors:

Dr. Paul W. Mertens, Marc Meuris and Marc Heyns

DOI:

https://doi.org/10.4028/b-OhG0v6

THEMA:

TGM

BISAC:

TEC021000

Keywords:

Cavitation, Cleaning, Copper (Cu), Germanium, HF, Megasonic, Megasonic Cleaning, Metal Gate, Particle Removal, Photoresist Stripping, Post-Etch Cleaning, SC-1, Silicon, Silicon-Germanium (SiGe), Single Wafer Cleaning, Supercritical CO₂, Surface Preparation, TXRF, Wet Cleaning, X-Ray Photoelectron Spectroscopy (XPS)

Details:

Selected, peer reviewed papers from the 8th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) held in Antwerp, Belgium, September 18-20, 2006

Pages:

400

Year:

2008

ISBN-13 (softcover):

9783908451464

ISBN-13 (CD):

9783908454304

ISBN-13 (eBook):

9783038131953

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