Ultra Clean Processing of Semiconductor Surfaces VIII

Ultra Clean Processing of Semiconductor Surfaces VIII

Description:

Volume is indexed by Thomson Reuters CPCI-S (WoS).
This collection of 86 peer-reviewed papers covers all aspects of the use of ultra-clean technology for large-scale integration on semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.

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Info:

eBook:
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ToC:
Table of contents
Editors:
Dr. Paul W. Mertens, Marc Meuris and Marc Heyns
DOI:
https://doi.org/10.4028/b-OhG0v6
THEMA:
TGM
BISAC:
TEC021000
Keywords:
Cavitation, Cleaning, Copper (Cu), Germanium, HF, Megasonic, Megasonic Cleaning, Metal Gate, Particle Removal, Photoresist Stripping, Post-Etch Cleaning, SC-1, Silicon, Silicon-Germanium (SiGe), Single Wafer Cleaning, Supercritical CO2, Surface Preparation, TXRF, Wet Cleaning, X-Ray Photoelectron Spectroscopy (XPS)
Details:
Selected, peer reviewed papers from the 8th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) held in Antwerp, Belgium, September 18-20, 2006
Pages:
400
Year:
2008
ISBN-13 (softcover):
9783908451464
ISBN-13 (CD):
9783908454304
ISBN-13 (eBook):
9783038131953
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