Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The contents of this publication include every conceivable issue related to contamination, cleaning and surface preparation during mainstream large-scale integrated circuit manufacture. Typically, silicon is used as the main semiconductor substrate. However, other semiconducting materials such as SiGe and SiC are currently being used in the source-sink junction areas, and materials such as Ge and III-V compounds are being considered for the transistor channel region of future-generation devices.

Ultra Clean Processing of Semiconductor Surfaces VIII

Edited by: Dr. Paul W. Mertens, Marc Meuris and Marc Heyns

Online since: November 2007

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This collection of 86 peer-reviewed papers covers all aspects of the use of ultra-clean technology for large-scale integration on semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.

Ultra Clean Processing of Silicon Surfaces VII

Edited by: Paul Mertens, Marc Meuris and Marc Heyns

Online since: April 2005

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This book is sub-divided into 10 different topical sections; each dealing with important issues in surface cleaning and preparation.

Ultra Clean Processing of Silicon Surfaces IV

Edited by: Marc Heyns, Marc Meuris and Paul Mertens

Online since: November 1998

Description: The proceedings of the Fourth International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS '98) cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).