The proceedings of the Fourth International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS '98) cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).

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eBook:

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ToC:

Table of contents

Editors:

Marc Heyns, Marc Meuris and Paul Mertens

DOI:

https://doi.org/10.4028/b-L4yTzR

THEMA:

TGM

BISAC:

TEC021000

Keywords:

Atomic Force Microscope (AFM), Cleaning, CMP, Contamination, HF, Impurity, Metal Contamination, Ozone, Particle, Photoresist, Plasma Etching, Post-Etch Residue Removal, Residue, SC-1, Silicon, SIMS, Solubility, Wafer Cleaning, Wet Cleaning, X-Ray Photoelectron Spectroscopy (XPS)

Details:

Proceedings of the Fourth International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS '98), held in Ostend, Belgium, September 1998

Pages:

316

Year:

1999

ISBN-13 (softcover):

9783908450405

ISBN-13 (CD):

9783038599999

ISBN-13 (eBook):

9783035706833

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