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Books by Keyword: Particle
Books
Edited by:
Prof. Akii Okonigbon Akaehomen Ibhadode, A.I. Igbafe and B.U. Anyata
Online since: February 2009
Description: This work comprises a selection of 109, peer-reviewed papers on Engineering Research and Development: Innovations. It addresses a number of the scientific issues underlying innovations in Materials and Systems research at the global level, while paying particular attention to possible processes that may permit the realization of the Millennium Development Goals (MDGs) of the United Nations in Developing Countries.The papers are grouped into chapters on: Construction and Structures; Electrical and Electronic Technology; Food and Agricultural Technology; Manufacturing Systems; Materials Processing; Oil and Gas; Renewable Energy; Systems Design and Analysis; Tools, Machines and Equipment; Waste Technology; and Water Engineering.
Edited by:
Paul Mertens, Marc Meuris and Marc Heyns
Online since: January 2009
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The contents of this publication include every conceivable issue related to contamination, cleaning and surface preparation during mainstream large-scale integrated circuit manufacture. Typically, silicon is used as the main semiconductor substrate. However, other semiconducting materials such as SiGe and SiC are currently being used in the source-sink junction areas, and materials such as Ge and III-V compounds are being considered for the transistor channel region of future-generation devices.
The contents of this publication include every conceivable issue related to contamination, cleaning and surface preparation during mainstream large-scale integrated circuit manufacture. Typically, silicon is used as the main semiconductor substrate. However, other semiconducting materials such as SiGe and SiC are currently being used in the source-sink junction areas, and materials such as Ge and III-V compounds are being considered for the transistor channel region of future-generation devices.
Edited by:
Guosheng Gai
Online since: October 2008
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS)
The technological demands on powder-processing of new materials, and on the associated resources, have reached a particularly prosperous state. Many types of industrial material processed using powder technology become the basis of important new materials, including those used in: building, papermaking, plastics, coatings, energy-use, environmental protection, etc. The cost and quality of raw industrial powder materials have a direct effect upon costs, benefits and market competitivity.
The technological demands on powder-processing of new materials, and on the associated resources, have reached a particularly prosperous state. Many types of industrial material processed using powder technology become the basis of important new materials, including those used in: building, papermaking, plastics, coatings, energy-use, environmental protection, etc. The cost and quality of raw industrial powder materials have a direct effect upon costs, benefits and market competitivity.
Edited by:
Xiaozhou Liao and Yonghao Zhao
Online since: April 2008
Description: Nanostructured materials, in which the structural features (e.g., grains and/or domains separated by low-angle grain boundaries) are smaller than 100nm in at least one dimension, have attracted worldwide research interest for more than a decade because of their unique properties. For example, the combination of high strength with high ductility has been reported for some nanostructured metals and alloys: this is a rare, if not impossible, combination of mechanical properties for coarse-grained metals and alloys. Among the many techniques available for producing nanostructured materials, severe plastic deformation (SPD) is the most popular and most rapidly developing one.
Edited by:
Marc Heyns, Marc Meuris and Paul Mertens
Online since: November 1998
Description: The proceedings of the Fourth International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS '98) cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).
Edited by:
G.M. Newaz, H. Neber-Aeschbacher and Fred H. Wohlbier
Online since: July 1995
Description: Ceramic matrix composites are under intense investigation internationally to find their useful application in higher temperature structures, particularly in aerospace propulsion systems.
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