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Books by Keyword: Ozone
Books
Edited by:
Guichun Liu and Xiuhua Peng
Online since: September 2013
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Collection of selected, peer reviewed papers from the 2013 International Conference on Environmental Biotechnology and Materials Engineering (EBME 2013), August 23-25, 2013, Tianjin, China.
The 90 papers are grouped as follows:
Chapter 1: Material Science and Chemical Environmental Technologies;
Chapter 2: Biomaterials and Biotechnology;
Chapter 3: Environmental Science and Engineering, Water Engineering and Management.
Collection of selected, peer reviewed papers from the 2013 International Conference on Environmental Biotechnology and Materials Engineering (EBME 2013), August 23-25, 2013, Tianjin, China.
The 90 papers are grouped as follows:
Chapter 1: Material Science and Chemical Environmental Technologies;
Chapter 2: Biomaterials and Biotechnology;
Chapter 3: Environmental Science and Engineering, Water Engineering and Management.
Edited by:
Paul Mertens, Marc Meuris and Marc Heyns
Online since: January 2009
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The contents of this publication include every conceivable issue related to contamination, cleaning and surface preparation during mainstream large-scale integrated circuit manufacture. Typically, silicon is used as the main semiconductor substrate. However, other semiconducting materials such as SiGe and SiC are currently being used in the source-sink junction areas, and materials such as Ge and III-V compounds are being considered for the transistor channel region of future-generation devices.
The contents of this publication include every conceivable issue related to contamination, cleaning and surface preparation during mainstream large-scale integrated circuit manufacture. Typically, silicon is used as the main semiconductor substrate. However, other semiconducting materials such as SiGe and SiC are currently being used in the source-sink junction areas, and materials such as Ge and III-V compounds are being considered for the transistor channel region of future-generation devices.
Edited by:
T. Vilaithong, D. Boonyawan and C. Thongbai
Online since: October 2005
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This collection presents, and analyses, the new ideas in the emerging technologies involved in the production and use of particle beams and plasmas.
This collection presents, and analyses, the new ideas in the emerging technologies involved in the production and use of particle beams and plasmas.
Edited by:
Paul Mertens, Marc Meuris and Marc Heyns
Online since: April 2005
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This book is sub-divided into 10 different topical sections; each dealing with important issues in surface cleaning and preparation.
This book is sub-divided into 10 different topical sections; each dealing with important issues in surface cleaning and preparation.
Edited by:
Marc Heyns, Marc Meuris and Paul Mertens
Online since: January 2001
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The proceedings of the Fifth International Symposium on Ultra Clean Processing of Silicon Surfaces cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).
The proceedings of the Fifth International Symposium on Ultra Clean Processing of Silicon Surfaces cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).
Edited by:
Marc Heyns, Marc Meuris and Paul Mertens
Online since: November 1998
Description: The proceedings of the Fourth International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS '98) cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).
Authors:
S. Incecik, E. Ekinci, F. Yardim, A. Bayram
Online since: July 1997
Description: In recent years, Air Quality Management has become of major importance, especially in megacities, i.e. those with more than 10 million inhabitants. The present publication provides scientists and engineers working in this area with the most recent results touching all major aspects of this highly important field.
Edited by:
Bernhard Elsener
Online since: January 1997
Description: One of the goals of the present publication is to forge a link between basic research, and applications in both civil and mechanical engineering.
Showing 1 to 8 of 8 Books