Books by Keyword: CMP

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The topics covered herein include: Single-point diamond turning; Ultra-precision grinding technology; High-speed and high-efficiency machining; Machine tools and systems; In-process measurement and monitoring; Metrology and evaluation; Finishing, lapping and polishing; Micro/nano machining and fabrication; Forming processes for optical and electrical components; CMP and silicon-wafer processing; Brittle-material machining; EDM, ultrasonic machining and laser machining; and Related precision machining methods. This work will provide a valuable and fruitful reference source for researchers in the field of ultra-precision machining who wish to understand, in greater depth, the underlying mechanisms and to create new and practical design technologies, systems and processes. It will also be particularly useful to practising engineers who are responsible for providing efficient, precise and effective machining.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Abrasive machining is one of the oldest technologies, and continues to have a far-reaching impact on a broad spectrum of industries. In particular, there is an ever-increasing demand by modern manufacturing for advanced abrasive techniques and other precision machining technologies. As well as abrasive-related technologies, electrical discharge machining (EDM), glass molding, machine tool systems, green manufacturing, laser-beam machining, tribology, advanced cutting methods, etc. are addressed here. The more than 167 presentations contributed by workers from all over the world will make this volume essential reading.

Description: This up-to-date collection, “Eco-Materials Processing and Design IX”, covers – on a global scale – the outstanding advances made in investigating, producing and using eco-materials. It furnishes materials scientists and end-users with a valuable source of information and new concepts covering the complete spectrum of ecology, eco-materials, nano-materials, bio-materials, recycling, environmental protection and energy conversion related materials.

Description: This book presents valuable up-to-date information for active researchers and engineers, and would certainly form a solid basis for any future research, in the field of abrasive technology, aimed at creating new and practical machine tools, systems and processes, or identifying new characteristics.

Description: The proceedings of the Fourth International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS '98) cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).