Engineering Research
Materials Science
Engineering Series
Ultra-Precision Machining Technologies, CJUMP2011
Description:
The topics covered herein include: Single-point diamond turning; Ultra-precision grinding technology; High-speed and high-efficiency machining; Machine tools and systems; In-process measurement and monitoring; Metrology and evaluation; Finishing, lapping and polishing; Micro/nano machining and fabrication; Forming processes for optical and electrical components; CMP and silicon-wafer processing; Brittle-material machining; EDM, ultrasonic machining and laser machining; and Related precision machining methods. This work will provide a valuable and fruitful reference source for researchers in the field of ultra-precision machining who wish to understand, in greater depth, the underlying mechanisms and to create new and practical design technologies, systems and processes. It will also be particularly useful to practising engineers who are responsible for providing efficient, precise and effective machining.
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Review from Ringgold Inc., ProtoView:
In this collection of selected, peer-reviewed papers from a November 2011 conference, researchers in Japan and China describe current work in the field of ultra-precision machining. Major themes include single-point diamond turning, ultra-precision grinding technology, high speed machining, and machine tools and systems, as well as in-process measurement and monitoring, metrology and evaluation, finishing and polishing, micro/nano machining and fabrication, forming processes for optical and electrical components, CMP and silicon wafer processing, brittle material machining, and ultrasonic and laser machining. Some specific paper topics include precision grinding of structured tungsten carbide molds, a new approach for noncircular following grinding of a crankshaft pin, and models for predicting surface roughness in austempered ductile iron. The book contains b&w photos and images.