Ultra-Precision Machining Technologies, CJUMP2011

Ultra-Precision Machining Technologies, CJUMP2011

Description:

Volume is indexed by Thomson Reuters CPCI-S (WoS).
The topics covered herein include: Single-point diamond turning; Ultra-precision grinding technology; High-speed and high-efficiency machining; Machine tools and systems; In-process measurement and monitoring; Metrology and evaluation; Finishing, lapping and polishing; Micro/nano machining and fabrication; Forming processes for optical and electrical components; CMP and silicon-wafer processing; Brittle-material machining; EDM, ultrasonic machining and laser machining; and Related precision machining methods. This work will provide a valuable and fruitful reference source for researchers in the field of ultra-precision machining who wish to understand, in greater depth, the underlying mechanisms and to create new and practical design technologies, systems and processes. It will also be particularly useful to practising engineers who are responsible for providing efficient, precise and effective machining.

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Info:

Editors:
Julong Yuan, Hitoshi Ohmori and Binghai Lv
THEMA:
PHV, TGB
BISAC:
TEC021000
Details:
Selected, peer reviewed papers from the 8th CHINA-JAPAN International Conference on Ultra-Precision Machining (CJUMP 2011), November 20-22, 2011, Hangzhou, P.R. China
Pages:
410
Year:
2012
ISBN-13 (softcover):
9783037853962
ISBN-13 (CD):
9783037952184
ISBN-13 (eBook):
9783038138143
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Review from Ringgold Inc., ProtoView: In this collection of selected, peer-reviewed papers from a November 2011 conference, researchers in Japan and China describe current work in the field of ultra-precision machining. Major themes include single-point diamond turning, ultra-precision grinding technology, high speed machining, and machine tools and systems, as well as in-process measurement and monitoring, metrology and evaluation, finishing and polishing, micro/nano machining and fabrication, forming processes for optical and electrical components, CMP and silicon wafer processing, brittle material machining, and ultrasonic and laser machining. Some specific paper topics include precision grinding of structured tungsten carbide molds, a new approach for noncircular following grinding of a crankshaft pin, and models for predicting surface roughness in austempered ductile iron. The book contains b&w photos and images.