Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The topics covered herein include: Single-point diamond turning; Ultra-precision grinding technology; High-speed and high-efficiency machining; Machine tools and systems; In-process measurement and monitoring; Metrology and evaluation; Finishing, lapping and polishing; Micro/nano machining and fabrication; Forming processes for optical and electrical components; CMP and silicon-wafer processing; Brittle-material machining; EDM, ultrasonic machining and laser machining; and Related precision machining methods. This work will provide a valuable and fruitful reference source for researchers in the field of ultra-precision machining who wish to understand, in greater depth, the underlying mechanisms and to create new and practical design technologies, systems and processes. It will also be particularly useful to practising engineers who are responsible for providing efficient, precise and effective machining.

Advances in Materials Processing IX

Edited by: Jun Wang,Philip Mathew, Xiaoping Li, Chuanzhen Huang and Hongtao Zhu

Online since: June 2010

Description: Materials processing is an important and essential step in the production of useful products, and is one of the major wealth-generating activities. With the increasing demand for the production of high precision, high integrity and high density devices and systems in modern life, materials processing has become more important than ever before. Following on from the previous eight publications in the series, “Asia-Pacific Conference on Materials Processing”, this volume presents the latest developments in this field, and a new understanding of the underlying mechanisms.