This book presents valuable up-to-date information for active researchers and engineers, and would certainly form a solid basis for any future research, in the field of abrasive technology, aimed at creating new and practical machine tools, systems and processes, or identifying new characteristics.

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eBook:

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ToC:

Table of contents

Editors:

Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa

DOI:

https://doi.org/10.4028/b-54YJ7z

THEMA:

TGM

BISAC:

TEC021000

Keywords:

Brittle Materials, Chemical Mechanical Polishing (CMP), Chip Formation, CMP, Coolant, Cutting Force, Dressing, ELID (ELectrolytic In-Process Dressing) Grinding, Finite Element Analysis (FEA), Floating Nozzle, Grinding, Grinding Force, Grinding Wheel, Molecular Dynamic (MD), MQL, Polishing, Simulation, Surface Quality, Surface Roughness (SR), Wheel Wear

Pages:

610

Year:

2004

ISBN-13 (hardcover):

9780878499335

ISBN-13 (CD):

9783038599357

ISBN-13 (eBook):

9783035706192

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