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Books by Keyword: Plasma Etching
Books
Edited by:
Prof. Victor Veliadis and Dr. Arash Salemi
Online since: September 2025
Description: This special edition aims to serve as a valuable resource for researchers and engineers engaged in developing and producing advanced semiconductor power devices. The publication provides readers with a balanced view of this field's scientific foundations and applied methodologies.
Edited by:
Prof. Michele Riccio, Prof. Andrea Irace and Prof. Giovanni Breglio
Online since: August 2024
Description: This special collection examines the intrinsic properties of semiconductor wafers and substrates, their mechanical, electrical, and thermal characteristics, and also the latest developments in SiC wafer production and processing, substrate preparation, and their integration into high-tech products which are critical to the functionality and reliability of modern electronic devices. By bringing together research and practical insights, the special edition will be a valuable resource for scientists and industry specialists seeking to harness the full potential of silicon carbide in the evolving landscape of innovation in semiconductor technologies.
Edited by:
Dr. Juraj Marek, Dr. Gregor Pobegen, Prof. Ulrike Grossner, Hamada Shoukry and Dr. Zhigang Fang
Online since: May 2023
Description: The special edition includes articles that represented the latest research results and engineering solutions in the synthesis of nanomaterials, analysis processes of semiconductor wafer fabrication, and some decisions on coatings and exploration of tribological performance of several polymer and composite materials. This special edition will be interesting to specialists in nanomaterials synthesis, semiconductor power device production and protective coatings in machinery.
Edited by:
Marc Heyns, Marc Meuris and Paul Mertens
Online since: November 1998
Description: The proceedings of the Fourth International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS '98) cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).
Edited by:
Dr. David J. Fisher
Online since: November 1997
Description: This volume presents a thorough treatment of the subject, covering a full decade of progress in the understanding of Diffusion in Silicon.
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