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Wafers and Substrates
Description:
This special collection examines the intrinsic properties of semiconductor wafers and substrates, their mechanical, electrical, and thermal characteristics, and also the latest developments in SiC wafer production and processing, substrate preparation, and their integration into high-tech products which are critical to the functionality and reliability of modern electronic devices. By bringing together research and practical insights, the special edition will be a valuable resource for scientists and industry specialists seeking to harness the full potential of silicon carbide in the evolving landscape of innovation in semiconductor technologies.
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eBook
978-3-0364-1634-2
$105.00 *
Print
978-3-0364-0634-3
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eBook+Print
978-3-0364-0634-3
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Info:
eBook:
ToC:
Editors:
Prof. Michele Riccio, Prof. Andrea Irace and Prof. Giovanni Breglio
THEMA:
PDT, TGM, TJ
BISAC:
SCI050000, TEC008000, TEC021000
Keywords:
Details:
Special topic volume with invited peer-reviewed papers only
Pages:
114
Year:
2024
ISBN-13 (softcover):
9783036406343
ISBN-13 (eBook):
9783036416342
Permissions CCC:
Permissions PLS:
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Ringgold Subjects:
Materials Science, Electronics, Nanoscience