Description: The 4th International Conference on Engineering Science and Innovative Technology (ESIT 2024) presented a crucial platform for academics, researchers, and industry professionals to explore and address the multifaceted challenges of our rapidly evolving world. This edition of the conference held at the Amari Pattaya, Thailand, on February 20-23, 2024, continued the tradition of fostering interdisciplinary collaboration and innovation in engineering science. Attendees benefited from a rich program featuring keynote speeches, diverse presentations, interactive workshops, and panel discussions on cutting-edge topics in energy management, industrial applications, and technological innovations. ESIT2024 aimed to not only share knowledge and research findings but also to inspire new ideas and collaborative efforts that will propel the field of engineering science forward.

Aluminum, Polymers, Composites and Applied Special Materials

Edited by: Assoc. Prof. Dr. Rattanakorn Phadungthin, Prof. Lorenzo Donati, Amjad Ali and Nicuşor Alin Sîrbu

Online since: October 2024

Description: In a world driven by technological innovation, materials are the foundation upon which new possibilities are built. This special edition invites readers to explore the research results on advanced materials, from structural and specialised polymers and composites and various functional materials to high-performance aluminum alloys.

Wafers and Substrates

Edited by: Prof. Michele Riccio, Prof. Andrea Irace and Prof. Giovanni Breglio

Online since: August 2024

Description: This special collection examines the intrinsic properties of semiconductor wafers and substrates, their mechanical, electrical, and thermal characteristics, and also the latest developments in SiC wafer production and processing, substrate preparation, and their integration into high-tech products which are critical to the functionality and reliability of modern electronic devices. By bringing together research and practical insights, the special edition will be a valuable resource for scientists and industry specialists seeking to harness the full potential of silicon carbide in the evolving landscape of innovation in semiconductor technologies.

Silicon Carbide Wafer Manufacturing, Optoelectronic and Electronic Devices and Technologies

Edited by: Dr. Juraj Marek, Dr. Gregor Pobegen, Prof. Ulrike Grossner and Dr. Hock Jin Quah

Online since: May 2023

Description: The special edition includes articles that represented the latest research results and engineering solutions in the area of electronic device design and production. This special edition will be interesting to specialists in semiconductor power device production, microelectronics and optoelectronics.

Ultra-Precision Machining Process and Surface Finishing Technology

Edited by: Bo Zhao, Guofu Gao, Hang Gao and Yanyan Yan

Online since: October 2014

Description: Collection of selected, peer reviewed papers from the 10^th CHINA-JAPAN International Conference on Ultra-Precision Machining Process (10th CJUMP) and 2014 International Conference on Surface Finishing Technology (ICSFT 2014), October 17-19, 2014, Jiaozuo, China.
The 76 papers are grouped as follows:
Chapter 1: Ultra-Precision Machining Process and Instrumentation,
Chapter 2: Surface Finishing Technology,
Chapter 3: Design, Fabrication and Analysis of Devices and Materials for the Applications of Machining Technologies.

Advances in Abrasive Technology XVI

Edited by: Julong Yuan, Ming Chen, Jun Wang, Libo Zhou and Binghai Lv

Online since: September 2013

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Abrasive machining is one kind of old technology, but it has a far-reaching impact on a broad spectrum of industries. In particular modern manufacturing, there is an ever increasing demand of advanced abrasive technology and other precision abrasive technology. The collection brings together both academic researchers and practitioners from around the world for interchange of the latest developments.
The 123 papers are grouped as follows:
1: Abrasive Jet Machining;
2: Abrasive Machining;
3: Advanced Cutting Technology;
4: Brittle Material Machining;
5: CMP and Silicon Wafer Processing;
6: Coolants and Cooling;
7: Design, Fabrication and Analysis of Devices for the Applications of Abrasive Technologies;
8: EDM, Ultrasonic Machining, and Laser Machining;
9: Finishing, Lapping and Polishing;
10: Glass Molding and Related Topics;
11: Grinding Wheel and Abrasive Grain Technologies;
12: In-Process Measurement and Monitoring, Metrology;
13: Machine Tools and Systems, Tooling Processing;
14: Micro/Nano-Machining;
15: Surface Integrity and Materials Characterization;
16: Tribology in Manufacturing;
17: Truing, Dressing and ELID.

Advanced Research on Information Science, Automation and Material System III

Edited by: Helen Zhang, David Jin and X.J. Zhao

Online since: June 2013

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Collection of selected, peer reviewed papers from the 2013 3rd International Conference on Information Science, Automation and Material System (ISAM 2013), April 13-14, 2013, Guangzhou, China.
The 77 papers are grouped as follows:
Chapter 1: Research on Material Science, Processing and Technologies;
Chapter 2: Geology, Extraction and Processing of Mineral Resource: Research and Technologies;
Chapter 3: Mechanics of Materials and Applied Mechanics;
Chapter 4: Research on Information System and Automation;
Chapter 5: Related Topics.