Books by Keyword: Copper (Cu)

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Deformation and annealing phenomena are of great technical significance to the processing and application of materials at the industrial scale. This edited collection of peer-reviewed papers was designed as a one-off vehicle for reviewing the current understanding of the basic mechanisms and processes that control deformation and annealing in various materials, together with their modelling and simulation. Another aim was to facilitate discussion of the failings of established theories, to explore new ideas, and to identify avenues where future research is required. The present papers apply these concepts to a wide range of materials and applications; from conventional steels and light alloys to nanocrystalline gold wires and geological samples.

Description: The topic of diffusion science becomes more and more important: this collection of timely papers is divided into seven chapters. The first three are dedicated to macroscopic and microscopic theories of diffusion.
Volume is indexed by Thomson Reuters CPCI-S (WoS).

Description: To the materials science community, Texture is an important property which describes the relative orientations of the various material elements which constitute the microstructure. These elements are usually the crystalline grains; each with a different orientation of its crystal lattice. However, morphological textures, such as the arrangement of fibers in a composite material, also have to be considered. In rare cases, the texture is random; with all possible orientations being equally represented in the material. But, usually, processing of the material has caused the texture to become non-random; with a consequent anisotropy of the material properties. Thus, not only metallurgists and materials scientists take an interest in textures, but also physicists, mathematicians, geologists, mechanical engineers and others.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Natural, as well as man-made, materials are often assumed to behave uniformly, exhibiting equal strength in all directions, because most of them have a polycrystalline structure. The anisotropy of the individual crystals, however, is smoothed out only in the presence of a large number of grains having a random distribution of orientations. In reality, there usually remains an anisotropy due to the existence of preferred orientations. Its magnitude depends upon the statistical distribution of grain orientations – the "crystallographic texture" or, more simply, the texture. –This governs the extremes, of the physical property of interest, which a single crystal of the material under consideration can exhibit in directional tests. Local variations in texture, as well as the arrangements and types of grain/phase boundaries, may give rise to inhomogeneous material properties. The texture also carries with it information on the history of a material’s processing, use and misuse. A knowledge of the texture is a prerequisite for all quantitative techniques of materials characterization, and is based upon the interpretation of diffraction-peak intensities. It is also necessary to model the relationships between microstructural features and physical or mechanical properties. Therefore, the texture is of great value for quality control in a wide range of industrial applications, and in basic materials research.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This book is sub-divided into 10 different topical sections; each dealing with important issues in surface cleaning and preparation.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Recrystallization and grain growth, together with phase transformations such as precipitation, are the fundamental processes of microstructural evolution which take place during the thermomechanical processing of engineering materials. They are of major scientific interest and are of great importance in a wide range of industrial applications. One of the main goals of this two-volume set is to show how to cover the entire set of reactions governing recrystallization and grain growth during industrial processing – termed through process modelling.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This book presents the proceedings of the second International Conference on Advanced Materials Processing (ICAMP 2002). The papers read during the conference are included here in full-length form. They comprise 2 keynote addresses, 9 invited papers and over 130 oral presentations, by delegates from more than 20 countries.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This volume is a collection of papers presented at the 10th International Autumn Meeting on "Gettering and Defect Engineering in Semiconductor Technology - GADEST 2003," which took place from the 21st to the 26th of September 2003 at the Seehotel Zeuthen, in the state of Brandenburg, Germany. The Seehotel Zeuthen, near Berlin, was an excellent location at which to provide a forum for interactions between scientists and engineers engaged in the field of semiconductor defect physics, materials science and technology; and to reflect upon aspects of the coming era of conversion from micro-electronics to nano-electronics. In addition, a particular ambition was to strengthen the interactions and exchanges between communities working in the fields of crystalline silicon for electronics and photovoltaics.

Description: The issues addressed by the Sixth International Symposium on the Ultra Clean Processing of Silicon Surfaces included all aspects of ultra-clean Si-technology, cleaning and contamination control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
This covered studies of Si-surface chemistry and topography and its relationship to device performance and process yield, cleaning in relationship to new gate stacks, cleaning at the interconnect level, resist stripping and polymer removal, cleaning and contamination control of various new materials, wafer backside cleaning and cleaning following Chemical-Mechanical-Polishing (CMP).

Description: Texture is a fundamental material characteristic which results from the microstructural evolution that takes place during various processes, including the thermomechanical deformation of materials. Therefore, texture-related phenomena will continue to be of great importance, because of their scientific interest as well as their effect upon industrial applications, in the 21st century.
Volume is indexed by Thomson Reuters CPCI-S (WoS).