Volume is indexed by Thomson Reuters CPCI-S (WoS).
This book presents the proceedings of the second International Conference on Advanced Materials Processing (ICAMP 2002). The papers read during the conference are included here in full-length form. They comprise 2 keynote addresses, 9 invited papers and over 130 oral presentations, by delegates from more than 20 countries.

Purchase this book:

eBook

978-3-0357-0607-9

$198.00 *

Add to Cart

978-0-87849-921-2

$314.00

not available

eBook+Print

978-0-87849-921-2

$409.60 *

not available

* 1-User Access (Single User-Price). For Multi-User-Price please fill a contact form

Info:

eBook:

View eBook preview

ToC:

Table of contents

Editors:

M.O. Lai and L. Lu

DOI:

https://doi.org/10.4028/b-sDc3zU

THEMA:

TGM

BISAC:

TEC021000

Keywords:

Analysis of Variance (ANOVA), Composite, Compression Testing, Copper (Cu), DC Plating, Finite Element Analysis (FEA), Forging, Hot Deformation, Magnesium Alloy, Mechanical Alloying (MA), Mechanical Property, Metal Matrix Composite (MMC), Microstructure, Modeling, Nanocomposite, Nanostructure, Nanowire, Plasma Spraying, Scanning Electron Microscope (SEM), X-Ray Diffraction (XRD)

Details:

Second International Conference on Advanced Materials Processing, Grand Hyatt, Singapore, 2-4 December 2002

Pages:

540

Year:

2003

ISBN-13 (softcover):

9780878499212

ISBN-13 (CD):

9783038599234

ISBN-13 (eBook):

9783035706079

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions