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HomeMaterials Science ForumMaterials Science Forum Vols. 126-128Stress-Voiding and Electromigration Failures in...

Stress-Voiding and Electromigration Failures in Narrow Metal Interconnects

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Intergranular and Interphase Boundaries in Materials

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Periodical:

Materials Science Forum (Volumes 126-128)

Pages:

351-354

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.126-128.351

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Online since:

January 1993

Authors:

C.S. Nichols, David A. Smith

Keywords:

Cavitation, Electromigration, Reliability of Interconnects, Stress-Voiding

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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