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HomeMaterials Science ForumMaterials Science Forum Vols. 126-128Microstructural Investigation of Grain Boundary...

Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites

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Intergranular and Interphase Boundaries in Materials

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Periodical:

Materials Science Forum (Volumes 126-128)

Pages:

399-402

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.126-128.399

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Online since:

January 1993

Authors:

J.S. Lee, T.H. Kim, K.H. Lee

Keywords:

GB Diffusion and Segregation of Cu in W, W Recrystallization, W-Cu Composite

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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