Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites

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Periodical:

Materials Science Forum (Volumes 126-128)

Edited by:

Ph. Komninou and A. Rocher

Pages:

399-402

DOI:

10.4028/www.scientific.net/MSF.126-128.399

Citation:

J.S. Lee et al., "Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites", Materials Science Forum, Vols. 126-128, pp. 399-402, 1993

Online since:

January 1993

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$35.00

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