Paper Titles

Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites
p.399

Oxygen Grain Boundary Diffusion in Alumina, Impurity Effects
p.403

The Influence of Interfacial Structure on the Diffusion of Ag along Ag-Cu Interphase Boundaries
p.407

Oxygen Self-Diffusion in Y₂O₃ Doped α Alumina
p.411

Grain Boundaries in Deposited Aluminum Thin Films
p.415

Effect of Solute Atoms on Rate of Boundary Migration for Body-Centered Cubic Alloys
p.419

The Effect of Nuclei Texture on the Geometry of Grains and Dis-Orientation of Grain Boundaries in Recrystallized Polycrystals
p.423

Microstructural Aspects of Grain Growth Induced by the Dopants in UO₂ Sintered Pellets
p.427

Nucleation and Grain Growth in Silicon Films Deposited by Thermal Decomposition of Disilane
p.431

HomeMaterials Science ForumMaterials Science Forum Vols. 126-128Grain Boundaries in Deposited Aluminum Thin Films

Grain Boundaries in Deposited Aluminum Thin Films

Article Preview

Abstract:

You might also be interested in these eBooks

Intergranular and Interphase Boundaries in Materials

Info:

Periodical:

Materials Science Forum (Volumes 126-128)

Pages:

415-418

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.126-128.415

Citation:

Cite this paper

Online since:

January 1993

Authors:

L.K. Fionova, O.V. Kononenko, V.N. Matveev

Keywords:

Al Film Structure, Grain Boundary, Partially Ionized Beam Deposition

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 1993 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: