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HomeMaterials Science ForumMaterials Science Forum Vols. 157-162Texture and Grain Structure Effects on the...

Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects

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Textures of Materials - ICOTOM 10

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Periodical:

Materials Science Forum (Volumes 157-162)

Pages:

1435-1442

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.157-162.1435

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Online since:

May 1994

Authors:

D.B. Knorr, K.P. Rodbell

Keywords:

Aluminium Alloy, Electromigration, Fiber Texture, Hillocks, Interconnect, Reliability, Stress Voiding

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© 1994 Trans Tech Publications Ltd. All Rights Reserved

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