Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects

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Periodical:

Materials Science Forum (Volumes 157-162)

Edited by:

H.J. Bunge

Pages:

1435-1442

DOI:

10.4028/www.scientific.net/MSF.157-162.1435

Citation:

D.B. Knorr and K.P. Rodbell, "Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects ", Materials Science Forum, Vols. 157-162, pp. 1435-1442, 1994

Online since:

May 1994

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$35.00

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