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HomeMaterials Science ForumMaterials Science Forum Vols. 207-209Intergranular Segregation in Cu(Ag) and Ag(Cu)...

Intergranular Segregation in Cu(Ag) and Ag(Cu) Systems: Analysis of the Driving Force Using a Tight-Binding Scheme

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Intergranular and Interphase Boundaries in Materials II

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Periodical:

Materials Science Forum (Volumes 207-209)

Pages:

701-704

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.207-209.701

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Online since:

February 1996

Authors:

F. Berthier, B. Legrand, G. Tréglia, L. Priester

Keywords:

Grain Boundary, Molecular Dynamic (MD), Segregation, Tight-Binding Potential

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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