This publication focuses on the structural and chemical characterization of interfaces and their kinetic, mechanical and electrical properties. The size of the volume, consisting of almost 200 papers and over 900 pages, reflects the great current interest in the field.

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eBook:

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ToC:

Table of contents

Editors:

A.C. Ferro, J.P. Conde and M.A. Fortes

DOI:

https://doi.org/10.4028/b-il4xtN

THEMA:

TGM

BISAC:

TEC021000

Keywords:

Aluminum (Al), Bi-Crystal, Diffusion, Dislocation, Electron Microscopy, Electronic Structure, Grain Boundary, Grain Boundary Diffusion, Grain Boundary Migration, Grain Boundary Segregation, Grain Boundary Structure, High Resolution Transmission Electron Microscopy, Interface, Metal/Ceramic Interface, Molecular Dynamic (MD), Precipitation, Segregation, Silicon, TEM, Thin Film

Details:

Proceedings of the 7th International Conference on Intergranular and Interphase Boundaries in Materials (iib 95), held in Lisboa, Portugal, June 1995

Pages:

920

Year:

1996

ISBN-13:

9780878497225

ISBN-13 (CD):

9783038598213

ISBN-13 (eBook):

9783035705058

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