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HomeMaterials Science ForumMaterials Science Forum Vols. 207-209Molecular Dynamics Investigation of the ∑5 Energy...

Molecular Dynamics Investigation of the ∑5 Energy Cusp in [001] Twist Boundaries in Cu₃Au at T=0 K

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Intergranular and Interphase Boundaries in Materials II

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Periodical:

Materials Science Forum (Volumes 207-209)

Pages:

833-836

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.207-209.833

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Online since:

February 1996

Authors:

I.P. Antoniades, A.J. Patrinos, G.L. Bleris

Keywords:

Binary Alloy, Cu₃Au, Dislocation, Grain Boundary, Molecular Dynamic (MD)

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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