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HomeMaterials Science ForumMaterials Science Forum Vols. 207-209

Materials Science Forum Vols. 207-209

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.207-209

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Table of Contents

Paper Title Page

Effects of Intragranular Deformation on Grain Boundary Sliding in Zinc Bicrystals

Authors: A.D. Sheikh-Ali, Ruslan Valiev

577

Dislocation/Grain Boundary Interactions in Ice Crystals under Creep Conditions

Authors: Ian Baker, F. Liu, K. Jia, X. Hu, Michael Dudley

581

An Example of Dynamic Embrittlement: Oxygen-Induced Cracking of a Cu-Be Alloy at 200°C

Authors: R. Muthiah, A. Guha, C.J. McMahon

585

Study of Doped-Intrinsic Interfaces in Amorphous Semiconductors Using Doping Multilayers

Authors: João Pedro Conde, Marcia Silva, V. Chu

589

Modelling Intergranular and Cleavage Fracture in Polycrystalline Materials

Authors: A. Crocker, G. Smith

593

The Influence of Interfacial Layers on the Ultimate Shear Strength of Copper/Sapphire Interfaces

Authors: G. Dehm, R. Raj, M. Rühle

597

Microstructure Evolution, Interface Distributions and Mechanical Behaviour of Austenitic Stainless Steels

Authors: V.Yu. Gertsman, O.V. Mishin, Ruslan Valiev

601

Elastic Behaviour of Screw Dislocations near Triple Junctions of Interphase Boundaries

Authors: Mikhail Yu. Gutkin, A.E. Romanov, Elias C. Aifantis

605

Fatigue Crack Propagation and Grain Boundary

Authors: S. Hashimoto, Alexei Vinogradov, Sei Miura

609

Interfaces and Ductility-Toughness in TiAl Intermetallic Compounds

Authors: L.L. He, Heng Qiang Ye

613