Paper Titles

An Example of Dynamic Embrittlement: Oxygen-Induced Cracking of a Cu-Be Alloy at 200°C
p.585

Study of Doped-Intrinsic Interfaces in Amorphous Semiconductors Using Doping Multilayers
p.589

Modelling Intergranular and Cleavage Fracture in Polycrystalline Materials
p.593

The Influence of Interfacial Layers on the Ultimate Shear Strength of Copper/Sapphire Interfaces
p.597

Microstructure Evolution, Interface Distributions and Mechanical Behaviour of Austenitic Stainless Steels
p.601

Elastic Behaviour of Screw Dislocations near Triple Junctions of Interphase Boundaries
p.605

Fatigue Crack Propagation and Grain Boundary
p.609

Interfaces and Ductility-Toughness in TiAl Intermetallic Compounds
p.613

EBIC and DLTS of the Electrical Activity of Fe-Contaminated Silicon Bicrystals
p.617

HomeMaterials Science ForumMaterials Science Forum Vols. 207-209Microstructure Evolution, Interface Distributions...

Microstructure Evolution, Interface Distributions and Mechanical Behaviour of Austenitic Stainless Steels

Article Preview

Abstract:

You might also be interested in these eBooks

Intergranular and Interphase Boundaries in Materials II

Info:

Periodical:

Materials Science Forum (Volumes 207-209)

Pages:

601-604

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.207-209.601

Citation:

Cite this paper

Online since:

February 1996

Authors:

V.Yu. Gertsman, O.V. Mishin, Ruslan Valiev

Keywords:

Austenitic Stainless Steel, Grain Boundary Character Distribution (GBCD), Grain Boundary Clustering, Grain Boundary Connectivity, Mechanical Behavior, Orientation Correlation, Texture, Triple Junctions Distribution

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 1996 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: