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HomeMaterials Science ForumMaterials Science Forum Vols. 210-213Thermal-Wave Imaging: A Non-Destructive Technique...

Thermal-Wave Imaging: A Non-Destructive Technique to Characterize the Electromigration on Al Alloy

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Nondestructive Characterization of Materials VII

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Periodical:

Materials Science Forum (Volumes 210-213)

Pages:

309-316

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.210-213.309

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Online since:

May 1996

Authors:

A. Brun, M. Marty, H. Roede, C. Gounelle, F. Giroux

Keywords:

Aluminum (Al), Electromigration, Thermal Wave

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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