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HomeMaterials Science ForumMaterials Science Forum Vols. 210-213Microwave Dielectric Characterization of Low...

Microwave Dielectric Characterization of Low Density Glass Fibers with Resin Binder

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Nondestructive Characterization of Materials VII

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Periodical:

Materials Science Forum (Volumes 210-213)

Pages:

657-664

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.210-213.657

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Online since:

May 1996

Authors:

N. Qaddoumi, S. Ganchev, R. Zoughi

Keywords:

Cure Amount Characterization, Low Density Fiber Glass, Microwave Dielectric Properties, Microwave Imaging, Resin Amount Characterization

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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