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HomeMaterials Science ForumMaterials Science Forum Vols. 210-213Determination and Monitoring of Through Hole...

Determination and Monitoring of Through Hole Diameters Using Acoustic Diffraction

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Nondestructive Characterization of Materials VII

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Periodical:

Materials Science Forum (Volumes 210-213)

Pages:

649-656

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.210-213.649

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Online since:

May 1996

Authors:

T.P. Berndt, R.E. Green, Jr.

Keywords:

Acoustic Diffraction, Diffraction Pattern, Printed Circuit Board (PCB), Process Control, Through Hole Diameter, Ultrasonic Transducer

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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