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HomeMaterials Science ForumMaterials Science Forum Vols. 233-234Micromechanism of Time Dependent Deformation and...

Micromechanism of Time Dependent Deformation and Fracture of Silicon Carbide under High Temperature Condition

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Periodical:

Materials Science Forum (Volumes 233-234)

Pages:

109-116

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.233-234.109

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Online since:

October 1996

Authors:

A.Toshimitsu Yokobori Jr., Toyohiko Yano, T.E. Mitchell

Keywords:

Creep Ductility, Micromechanisms, Silicon Carbide (SiC), Void Formation

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© 1997 Trans Tech Publications Ltd. All Rights Reserved

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