Paper Titles

Application of Surface Ab Initio Methods to Studies of Electronic Structure and Atomic Configuration of Interfaces in Metallic Materials
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High Resolution Study of a Quasiperiodic Grain Boundary in Gold
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Effect of Grain Boundary Dislocations on 9R Stacking Errors at an Incoherent Twin Boundary in Copper
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In situ High-Resolution Transmission Electron Microscopy of Interfaces in Phase Transformations
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The Effects of Thermomechanical Processing on Interfacial Crystallography in Metals
p.51

Grain Boundaries in Superplastic Ceramics
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Radiation-Induced Grain Boundary Segregation
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Grain Boundary Composition and Effects on Environmental Degradation
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Modelling Nonequilibrium Grain Boundary Segregations
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HomeMaterials Science ForumMaterials Science Forum Vols. 294-296The Effects of Thermomechanical Processing on...

The Effects of Thermomechanical Processing on Interfacial Crystallography in Metals

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Intergranular and Interphase Boundaries in Materials III

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Periodical:

Materials Science Forum (Volumes 294-296)

Pages:

51-58

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.294-296.51

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Online since:

November 1998

Authors:

Valerie Randle

Keywords:

Coherent Twins, Coincidence Site Lattice Boundary, Grain Boundary Engineering, Relative Boundary Specialness, Σ3 Regeneration Model

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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