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Intergranular and Interphase Boundaries in Materials III
Description:
Continuing the scope of the preceding Conferences on Intergranular and Interphase Boundaries in Materials, the present conference focused on the atomic-level modeling of interfaces, the structural and chemical characterization of internal interfaces, on their thermodynamic, kinetic, mechanical, electrical, magnetic behavior and high-Tc superconductivity, and on the application of current knowledge to the design of polycrystalline materials having improved properties. Particular attention was paid to non-equilibrium segregation in irradiated materials.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
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Info:
eBook:
ToC:
Editors:
Pavel Lejcek and Václav Paidar
THEMA:
TGM
BISAC:
TEC021000
Keywords:
Aluminum (Al), Bi-Crystal, Copper (Cu), Electron Microscopy, Grain Boundary, Grain Boundary Core, Grain Boundary Diffusion, Grain Boundary Dislocation, Grain Boundary Migration, High Resolution Electron Microscopy (HREM), High Resolution Transmission Electron Microscopy, Interface, Interphase Boundaries, Irradiation, Metal, Segregation, Silicon, Silicon Carbide (SiC), Surface Segregation, TEM
Details:
Proceedings of the 9th International Conference on Intergranular and Interphase Boundaries in Materials (iib 98), held in Prague, Czech Republic, July 1998
Pages:
840
Year:
1999
ISBN-13:
9780878498239
ISBN-13 (CD):
9783038598510
ISBN-13 (eBook):
9783035705355
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