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HomeMaterials Science ForumMaterials Science Forum Vols. 294-296Grain Boundary Penetration of Liquid Bi in Cu...

Grain Boundary Penetration of Liquid Bi in Cu Polycrystals

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Intergranular and Interphase Boundaries in Materials III

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Periodical:

Materials Science Forum (Volumes 294-296)

Pages:

735-738

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.294-296.735

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Online since:

November 1998

Authors:

B. Joseph, F. Barbier, M. Aucouturier

Keywords:

Embrittlement, Grain Boundary, Grooving, Liquid Bi, Penetration, Polycrystalline Cu

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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