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HomeMaterials Science ForumMaterials Science Forum Vols. 308-311A Thermal Damage-Heat Conduction Coupled Model of...

A Thermal Damage-Heat Conduction Coupled Model of Ceramic-Metal Functionally Graded Materials

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Abstract:

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Functionally Graded Materials

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Periodical:

Materials Science Forum (Volumes 308-311)

Pages:

1030-1034

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.308-311.1030

Citation:

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Online since:

May 1999

Authors:

Qing Jie Zhang, Peng Cheng Zhai, Run Zhang Yuan

Keywords:

Crack Density, Effective Thermal Conductivity, Functionally Graded Material (FGM), Self-Consistent Micromechanics, Thermal Shock Damage

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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