A Thermal Damage-Heat Conduction Coupled Model of Ceramic-Metal Functionally Graded Materials

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Periodical:

Materials Science Forum (Volumes 308-311)

Edited by:

W.A. Kaysser

Pages:

1030-1034

DOI:

10.4028/www.scientific.net/MSF.308-311.1030

Citation:

Q. J. Zhang et al., "A Thermal Damage-Heat Conduction Coupled Model of Ceramic-Metal Functionally Graded Materials", Materials Science Forum, Vols. 308-311, pp. 1030-1034, 1999

Online since:

May 1999

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$35.00

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