The Ti-Ni-Me and Cu-Al-Me Melt-Spun Shape Memory Ribbons: Relation between the Microstructure and Functional Properties

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Periodical:

Materials Science Forum (Volumes 327-328)

Edited by:

Toshio Saburi

Pages:

307-310

DOI:

10.4028/www.scientific.net/MSF.327-328.307

Citation:

V. Kolomytsev et al., "The Ti-Ni-Me and Cu-Al-Me Melt-Spun Shape Memory Ribbons: Relation between the Microstructure and Functional Properties", Materials Science Forum, Vols. 327-328, pp. 307-310, 2000

Online since:

January 2000

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$35.00

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