The Application of the Solute Sweeping Model for Grain Boundary Liquation during Welding and Sub-Solidus Annealing of an Al-Cu Alloy

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Periodical:

Materials Science Forum (Volumes 331-337)

Edited by:

E.A. Starke, Jr., T.H. Sanders, Jr., W.A. Cassada

Pages:

1113-1118

DOI:

10.4028/www.scientific.net/MSF.331-337.1113

Citation:

A. L. Wilson et al., "The Application of the Solute Sweeping Model for Grain Boundary Liquation during Welding and Sub-Solidus Annealing of an Al-Cu Alloy", Materials Science Forum, Vols. 331-337, pp. 1113-1118, 2000

Online since:

May 2000

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